Images are for reference only.
See Product Specifications for product details.
| Part Number | B3MAUH |
|---|---|
| Part Status | Active |
| Connector Type | Receptacle, Male Pins |
| Number of Positions | 3 |
| Shell Size - Insert | XLR |
| Shell Size, MIL | - |
| Mounting Type | Panel Mount, Bulkhead - Rear Side Nut |
| Termination | Solder Cup |
| Fastening Type | Latch Lock |
| Orientation | Keyed |
| Ingress Protection | IP66 - Dust Tight, Water Resistant |
| Shell Material, Finish | Zinc Die Cast, Nickel Plated |
| Contact Finish | Gold |
| Features | - |
| Voltage - Rated | 500VAC |
| Current Rating | - |
| Image | Part Number | Manufacturers | Description | In Stock | View | |
|---|---|---|---|---|---|---|
 |
B3003 | Laird Technologies IAS | RF ANT 300MHZ WHIP STR NMO BASE | - | 2013 | Details |
|
B3003S | Laird Technologies IAS | ANT WHIP MC 5/8 300-340MHZ | - | 0 | Details |
 |
B300D44A102XXG | ON Semiconductor | IC PROCESSOR AUDIO 24BIT 44DFN | 0 | Details | |
 |
B300W35A102XYG | ON Semiconductor | IC PROCESSOR AUDIO 24BIT 35WLCSP | 0 | Details | |
 |
B300W35A109XXG | ON Semiconductor | IC PROCESSOR AUDIO 24BIT 35WLCSP | - | 0 | Details |
 |
B30810D6101Q819 | EPCOS (TDK) | MODULE WLAN 802.11B/G | 0 | Details | |
|
B30821D2036Q828 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | WIRELESS MODULE WLAN | - | 0 | Details |
|
B3083W | Laird Technologies IAS | WHIP MC ANTENNA | - | 0 | Details |
|
B30931D7020Y918 | EPCOS (TDK) | MODULE WLAN | 0 | Details | |
 |
B30B-PHDSS | JST Sales America Inc. | CONN HEADER PHD TOP 30POS 2MM | 0 | Details | |
 |
B30B-PHDSS(LF)(SN) | JST Sales America Inc. | CONN HEADER PHD TOP 30POS 2MM | 9112 | Details | |
 |
B30B-PNDZS-1 (T) (LF)(SN) | JST Sales America Inc. | CONN HEADR PND TOP 30POS 2MM PCB | 618 | Details |