Images are for reference only.
See Product Specifications for product details.
| Part Number | XR2D-2401-N |
|---|---|
| Part Status | Obsolete |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 29.5µin (0.75µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Carrier |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 29.5µin (0.75µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature | -55°C ~ 125°C |
| Image | Part Number | Manufacturers | Description | In Stock | View | |
|---|---|---|---|---|---|---|
|
XR2D-2401-N | Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | 0 | Details | |
|
XR2D-4001-N | Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 40POS GOLD | 0 | Details |