Images are for reference only.
See Product Specifications for product details.
Part Number | 224-7397-55-1902 |
---|---|
Part Status | Active |
Type | SOIC |
Number of Positions or Pins (Grid) | 24 (2 x 12) |
Pitch - Mating | - |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | - |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | - |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 30µin (0.76µm) |
Contact Material - Post | Beryllium Copper |
Housing Material | Polyethersulfone (PES), Glass Filled |
Operating Temperature | -55°C ~ 150°C |