Images are for reference only.
See Product Specifications for product details.
| Part Number | 208-7391-55-1902 |
|---|---|
| Part Status | Active |
| Type | SOIC |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Pitch - Mating | - |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30µin (0.76µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | - |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30µin (0.76µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyethersulfone (PES), Glass Filled |
| Operating Temperature | -55°C ~ 150°C |
| Image | Part Number | Manufacturers | Description | In Stock | View | |
|---|---|---|---|---|---|---|
 |
208-7391-55-1902 | 3M | CONN SOCKET SOIC 8POS GOLD | 940 | Details |